200mm (8 inch) Silicon Wafer

Product Detail Specifications

General Specification

ITEMS SPEC TEST METHOD
Growth Technique CZ -
Diameter 200.0±0.5mm -
Type/Dopant P/Boron, N/Phosphorus, N/Antimony -
Resistivity 1~30Ωcm -
Crystal Orientation (100), (111), (110) -
Orientation Flat SEMI-STD -
Thickness 725±25μm -
Warp < 30.0μm -
Global TTV < 30μm -
Global TIR < 5.0μm -

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Wafer Specifications

Ω-cm
μm
pcs

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